In the country on Vistula (and not only) there are still many people who have not even heard of an eSIM, and the iSIM is already looming. Qualcomm, Vodafone and Thales are working on the new solution. It is entirely possible that we will be using it later this year, although knowing the current facts (khem delays…everything), we would enthusiastically recommend while reading the basic data on the iSIM. Simplifying as possible, the iSIM (integrated SIM) is an integral part of the smartphone’s CPU, so it does not require a dedicated space to work, as in the case of a classic SIM (physical tray) or even an eSIM (a dedicated space with paths on the Motherboard).
To work, the SIM card needs space in the smartphone in the form of a tray. An eSIM uses a dedicated chip on the motherboard. iSIM must be integrated into the CPU, so that it does not take up extra space.
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The aforementioned companies working on an iSIM solution reveal that this work is already at a very advanced stage. So that they can offer the best advantages of using an iSIM without hesitation. The first is to “loosen” the space in the smartphone for other components, or simply to make the smartphones themselves thinner than before. Moreover, the possibility of creating multiple accounts for a single device, increased security or higher battery performance associated with lower power consumption was mentioned.
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Finally, the possibility of iSIM implementation for non-smartphone devices was mentioned, for example for VR/AR glasses, wearable devices or using iSIM for IoT branch development. The creators of the new solution conducted a successful test with its participation, using the Samsung Galaxy Z Flip3 5G smartphone equipped with a Snapdragon 888 5G chip and SPU (Secure Processing Unit). Commercial emergence of this solution may be around the corner.
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